Overview

Flexible Software Package (FSP) for Renesas RA Wireless MCUs

FSP is the next generation Arm® MCU software package from Renesas, that enables secure devices and IoT connectivity through production ready peripheral drivers, Azure RTOS or FreeRTOS, and portable middleware stacks. FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease implementation of complex modules like communication and security. The e² studio ISDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using your preferred RTOS, legacy code, and third-party ecosystem solutions.

Current Release

[RAFW FSP v2.1.0]

Supported RA MCU Kits

• EVB-RRQ6105X
• EVB-RRQ614XX
• EVB-RRQ61XXX

Setup Instructions

For existing users that are using FSP with e² studio

• RAFW FSP version 2.1.0 require a minimum e² studio version of 2026-04.2.

For new users that are using FSP with e² studio

1. Download the FSP with e² studio Installer from the Assets section of the current release.
2. Run the installer. This will install the e² studio tool, FSP packs, chosen toolchains (GCC and/or LLVM) and other tools required to use this software. No additional installations are required.

Starting Development

1. Open e² studio and click File > New > C/C++ Project.
2. In the window that pops up, choose Renesas RA for Wireless in the left pane.

Related Links

FSP Releases : https://github.com/renesas/rafw-fsp/releases

RAFW Product Information: https://www.renesas.com/en/products/wireless-connectivity

e² studio : www.renesas.com/e2studio

Example Projects : https://github.com/renesas/rafw-fsp-examples

Knowledge Base: https://en-support.renesas.com/knowledgeBase/category/31087

Support: www.renesas.com/support